Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

IW-HSKALU-CLASLR-CU03

iWave Systems

Product No:

Manufacturer:

Package:

Batch:

Datasheet:

Description:

ZU+ MPSOC SOM MODULE HEATSINK

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

Contact Name

Company name

Country

Quantity

Mfr	iWave Systems
Type	Top Mount
Shape	Rectangular, Fins
Width	2.953" (75.00mm)
Length	3.740" (95.00mm)
Series	-
Package	Bulk
Diameter	-
Material	Aluminum
Fin Height	1.181" (30.00mm)
Package Cooled	FPGA
Product Status	Active
Material Finish	-
Attachment Method	Bolt On
Thermal Resistance @ Natural	-
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	-