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IC-316-SGT

Samtec Inc.

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IC-316-SGT

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CONN IC DIP SOCKET 16POS GOLD

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Mfr	Samtec Inc.
Type	DIP, 0.3" (7.62mm) Row Spacing
Series	IC
Package	Bulk
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Mounting Type	Through Hole
Pitch - Mating	0.100" (2.54mm)
Product Status	Obsolete
Housing Material	Polyester, Glass Filled
Contact Resistance	10mOhm
Base Product Number	IC-316
Contact Finish - Post	Gold
Current Rating (Amps)	1 A
Operating Temperature	-55°C ~ 125°C
Contact Finish - Mating	Gold
Contact Material - Post	Phosphor Bronze
Termination Post Length	0.125" (3.18mm)
Contact Material - Mating	Beryllium Copper
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Number of Positions or Pins (Grid)	16 (2 x 8)