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HPF-09-02-TM-S

Samtec Inc.

Product No:

HPF-09-02-TM-S

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Description:

.200 HI POWER SOCKET ASSEMBLY

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Mfr	Samtec Inc.
Style	Board to Board
Series	HPF
Package	Bulk
Features	-
Termination	Solder
Applications	-
Contact Type	Female Socket
Contact Shape	Square
Mounting Type	Surface Mount
Connector Type	Receptacle
Fastening Type	Push-Pull
Number of Rows	1
Pitch - Mating	0.200" (5.08mm)
Product Status	Active
Voltage Rating	-
Contact Material	Beryllium Copper
Insulation Color	Black
Insulation Height	0.351" (8.92mm)
Ingress Protection	-
Base Product Number	HPF-09
Insulation Material	Liquid Crystal Polymer (LCP)
Number of Positions	9
Row Spacing - Mating	-
Contact Finish - Post	Tin
Contact Length - Post	-
Current Rating (Amps)	-
Operating Temperature	-
Mated Stacking Heights	-
Contact Finish - Mating	Tin
Number of Positions Loaded	All
Material Flammability Rating	-
Contact Finish Thickness - Post	-
Contact Finish Thickness - Mating	-