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Samtec Inc.
Product No:
HPF-07-02-T-S-K
Manufacturer:
Package:
-
Batch:
-
Datasheet:
-
Description:
.200 HI POWER SOCKET ASSEMBLY
Quantity:
Delivery:
Payment:
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Mfr | Samtec Inc. |
Style | Board to Board |
Series | HPF |
Package | Bulk |
Features | Pick and Place |
Termination | Solder |
Applications | - |
Contact Type | Female Socket |
Contact Shape | Square |
Mounting Type | Surface Mount |
Connector Type | Receptacle |
Fastening Type | Push-Pull |
Number of Rows | 1 |
Pitch - Mating | 0.200" (5.08mm) |
Product Status | Active |
Voltage Rating | - |
Contact Material | Beryllium Copper |
Insulation Color | Black |
Insulation Height | 0.351" (8.92mm) |
Ingress Protection | - |
Base Product Number | HPF-07 |
Insulation Material | Liquid Crystal Polymer (LCP) |
Number of Positions | 7 |
Row Spacing - Mating | - |
Contact Finish - Post | Tin |
Contact Length - Post | - |
Current Rating (Amps) | - |
Operating Temperature | - |
Mated Stacking Heights | - |
Contact Finish - Mating | Tin |
Number of Positions Loaded | All |
Material Flammability Rating | - |
Contact Finish Thickness - Post | - |
Contact Finish Thickness - Mating | - |