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HIC-764-SST

Samtec Inc.

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HIC-764-SST

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CONN IC DIP SOCKET 64POS GOLD

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Mfr	Samtec Inc.
Type	DIP, 0.75" (19.05mm) Row Spacing
Series	HIC
Package	Tube
Features	Open Frame
Termination	Solder
Pitch - Post	0.070" (1.78mm)
Mounting Type	Through Hole
Pitch - Mating	0.070" (1.78mm)
Product Status	Obsolete
Housing Material	Polyester, Glass Filled
Contact Resistance	-
Base Product Number	HIC-764
Contact Finish - Post	Gold
Operating Temperature	-
Contact Finish - Mating	Gold
Contact Material - Post	Brass
Termination Post Length	0.118" (3.00mm)
Contact Material - Mating	Beryllium Copper
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Number of Positions or Pins (Grid)	64 (2 x 32)