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FI-XPB30SRL-HF11

JAE Electronics

Product No:

FI-XPB30SRL-HF11

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Description:

CONN RCPT 30P 0.039 GOLD SMD R/A

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Mfr	JAE Electronics
Style	Board to Cable/Wire
Series	FI-XP
Package	Tray
Features	Grounding Pins, Shielded, Solder Retention
Termination	Solder
Applications	-
Contact Type	Non-Gendered
Contact Shape	-
Mounting Type	Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle, Reverse Mount
Connector Type	Receptacle
Fastening Type	Friction Lock
Number of Rows	1
Pitch - Mating	0.039" (1.00mm)
Product Status	Obsolete
Voltage Rating	-
Contact Material	Copper Alloy
Insulation Color	Black
Insulation Height	-
Ingress Protection	-
Base Product Number	FI-XPB30
Insulation Material	Plastic
Number of Positions	30
Row Spacing - Mating	-
Contact Finish - Post	Tin
Contact Length - Post	-
Current Rating (Amps)	-
Operating Temperature	-
Mated Stacking Heights	-
Contact Finish - Mating	Gold
Number of Positions Loaded	All
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	-
Contact Finish Thickness - Mating	12.0µin (0.30µm)