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FI-XB30SSRLA-HF16

JAE Electronics

Product No:

FI-XB30SSRLA-HF16

Manufacturer:

JAE Electronics

Package:

-

Batch:

-

Datasheet:

-

Description:

CONN RCPT 30P 0.039 GOLD SMD R/A

Quantity:

Delivery:

Payment:

In Stock : 3267

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $16.8435

    $16.8435

  • 10

    $14.59865

    $145.9865

  • 100

    $12.03213

    $1203.213

  • 500

    $10.989353

    $5494.6765

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FI-XB30SSRLA-HF16 - Product Information

Parameter Info

User Guide

Mfr JAE Electronics
Style Board to Cable/Wire
Series FI-X
Package Strip
Features Grounding Pins, Shielded, Solder Retention
Termination Solder
Applications General Purpose
Contact Type Non-Gendered
Contact Shape -
Mounting Type Board Cutout, Bottom Mount, Surface Mount, Right Angle, Reverse Mount
Connector Type Receptacle
Fastening Type Friction Lock
Number of Rows 1
Pitch - Mating 0.039" (1.00mm)
Product Status Active
Voltage Rating 200V
Contact Material Copper Alloy
Insulation Color Black
Insulation Height -
Ingress Protection -
Base Product Number FI-XB30
Insulation Material Plastic
Number of Positions 30
Row Spacing - Mating -
Contact Finish - Post Tin
Contact Length - Post -
Current Rating (Amps) 1A per Contact
Operating Temperature -40°C ~ 80°C
Mated Stacking Heights -
Contact Finish - Mating Gold
Number of Positions Loaded All
Material Flammability Rating UL94 V-0
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 3.90µin (0.099µm)