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JAE Electronics
Product No:
FI-XB30SSRLA-HF16
Manufacturer:
Package:
-
Batch:
-
Datasheet:
-
Description:
CONN RCPT 30P 0.039 GOLD SMD R/A
Quantity:
Delivery:
Payment:
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$16.8435
$16.8435
10
$14.59865
$145.9865
100
$12.03213
$1203.213
500
$10.989353
$5494.6765
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Mfr | JAE Electronics |
Style | Board to Cable/Wire |
Series | FI-X |
Package | Strip |
Features | Grounding Pins, Shielded, Solder Retention |
Termination | Solder |
Applications | General Purpose |
Contact Type | Non-Gendered |
Contact Shape | - |
Mounting Type | Board Cutout, Bottom Mount, Surface Mount, Right Angle, Reverse Mount |
Connector Type | Receptacle |
Fastening Type | Friction Lock |
Number of Rows | 1 |
Pitch - Mating | 0.039" (1.00mm) |
Product Status | Active |
Voltage Rating | 200V |
Contact Material | Copper Alloy |
Insulation Color | Black |
Insulation Height | - |
Ingress Protection | - |
Base Product Number | FI-XB30 |
Insulation Material | Plastic |
Number of Positions | 30 |
Row Spacing - Mating | - |
Contact Finish - Post | Tin |
Contact Length - Post | - |
Current Rating (Amps) | 1A per Contact |
Operating Temperature | -40°C ~ 80°C |
Mated Stacking Heights | - |
Contact Finish - Mating | Gold |
Number of Positions Loaded | All |
Material Flammability Rating | UL94 V-0 |
Contact Finish Thickness - Post | - |
Contact Finish Thickness - Mating | 3.90µin (0.099µm) |