Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

FI-XB30S-HF10-NPB

JAE Electronics

Product No:

FI-XB30S-HF10-NPB

Manufacturer:

Package:

Batch:

Datasheet:

Description:

CONN RCPT 30P 0.039 GOLD SMD R/A

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

Contact Name

Company name

Country

Quantity

Mfr	JAE Electronics
Style	Board to Cable/Wire
Series	FI-X
Package	Tray
Features	Grounding Pins, Shielded, Solder Retention
Termination	Solder
Applications	General Purpose
Contact Type	Non-Gendered
Contact Shape	-
Mounting Type	Board Cutout, Bottom Mount, Surface Mount, Right Angle
Connector Type	Receptacle
Fastening Type	Friction Lock
Number of Rows	1
Pitch - Mating	0.039" (1.00mm)
Product Status	Obsolete
Voltage Rating	200V
Contact Material	Copper Alloy
Insulation Color	Beige
Insulation Height	-
Ingress Protection	-
Base Product Number	FI-XB30
Insulation Material	Plastic
Number of Positions	30
Row Spacing - Mating	-
Contact Finish - Post	Tin
Contact Length - Post	-
Current Rating (Amps)	1A per Contact
Operating Temperature	-40°C ~ 80°C
Mated Stacking Heights	-
Contact Finish - Mating	Gold
Number of Positions Loaded	All
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	-
Contact Finish Thickness - Mating	-