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FI-TD50SB-E-R1500

JAE Electronics

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FI-TD50SB-E-R1500

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Description:

CONN RCPT 50POS 0.05 GOLD SMD

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Mfr	JAE Electronics
Style	Board to Cable/Wire
Series	FI-D
Package	Tape & Reel (TR)
Features	Board Guide, Pick and Place, Solder Retention
Termination	Solder
Applications	General Purpose
Contact Type	Center Strip Contact
Contact Shape	-
Mounting Type	Surface Mount
Connector Type	Receptacle
Fastening Type	Latch Holder
Number of Rows	1
Pitch - Mating	0.020" (0.50mm)
Product Status	Obsolete
Voltage Rating	-
Contact Material	Copper Alloy
Insulation Color	Black
Insulation Height	0.110" (2.79mm)
Ingress Protection	-
Base Product Number	FI-TD50
Insulation Material	Thermoplastic
Number of Positions	50
Row Spacing - Mating	-
Contact Finish - Post	Tin
Contact Length - Post	-
Current Rating (Amps)	0.5A per Contact
Operating Temperature	-40°C ~ 85°C
Mated Stacking Heights	4.5mm
Contact Finish - Mating	Gold
Number of Positions Loaded	All
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	-
Contact Finish Thickness - Mating	30.0µin (0.76µm)