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FI-TD50SB-E
JAE Electronics
Product No:
FI-TD50SB-E
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
CONN RCPT 50POS 0.05 GOLD SMD
Quantity:
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In Stock : Please Inquiry 
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FI-TD50SB-E - Product Information
Parameter Info
User Guide
| Mfr | JAE Electronics |
| Style | Board to Cable/Wire |
| Series | FI-D |
| Package | Bulk |
| Features | Board Guide, Pick and Place, Solder Retention |
| Termination | Solder |
| Applications | General Purpose |
| Contact Type | Center Strip Contact |
| Contact Shape | - |
| Mounting Type | Surface Mount |
| Connector Type | Receptacle |
| Fastening Type | Latch Holder |
| Number of Rows | 1 |
| Pitch - Mating | 0.020" (0.50mm) |
| Product Status | Obsolete |
| Voltage Rating | - |
| Contact Material | Copper Alloy |
| Insulation Color | Black |
| Insulation Height | 0.110" (2.79mm) |
| Ingress Protection | - |
| Base Product Number | FI-TD50 |
| Insulation Material | Thermoplastic |
| Number of Positions | 50 |
| Row Spacing - Mating | - |
| Contact Finish - Post | Tin |
| Contact Length - Post | - |
| Current Rating (Amps) | 0.5A per Contact |
| Operating Temperature | -40°C ~ 85°C |
| Mated Stacking Heights | 4.5mm |
| Contact Finish - Mating | Gold |
| Number of Positions Loaded | All |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish Thickness - Post | - |
| Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
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