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EXB-SN96.5AG3.0CU0.5

Chip Quik Inc.

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SOLDER BAR SN96.5/AG3.0/CU0.5 1L

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In Stock : 15

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Mfr	Chip Quik Inc.
Form	Bar, 1 lb (454g)
Type	Bar Solder
Series	Super Low Dross™
Package	Bulk
Process	Lead Free
Diameter	-
Flux Type	-
Shelf Life	-
Wire Gauge	-
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point	423 ~ 428°F (217 ~ 220°C)
Product Status	Active
Shelf Life Start	-
Base Product Number	EXB-SN96
Storage/Refrigeration Temperature	-