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EVSF100-25

CR Technology

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EVSF100-25

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Thermal Pad (EverTherm)

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Mfr	CR Technology
Type	Gap Filler Pad, Sheet
Color	White
Shape	-
Usage	Thermally Conductive
Series	EVSF
Outline	200.00mm x 300.00mm
Package	Sheet
Adhesive	-
Material	-
Thickness	0.0394" (1.000mm)
Shelf Life	-
Product Status	Active
Backing, Carrier	-
Digi-Key Storage	-
Shelf Life Start	-
Thermal Resistivity	0.9°C/W
Thermal Conductivity	1.5W/m-K
Storage/Refrigeration Temperature	-