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EVSC800-PI-2-K6

CR Technology

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EVSC800-PI-2-K6

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Thermal Insulation Pad

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Mfr	CR Technology
Type	Ultra Thin Dielectric Sheet
Color	Gray
Shape	-
Usage	Multi
Series	EVSC
Outline	305.00mm x 305.00mm
Package	Sheet
Adhesive	-
Material	Silicone
Thickness	0.0063" (0.160mm)
Shelf Life	-
Product Status	Active
Backing, Carrier	-
Digi-Key Storage	-
Shelf Life Start	-
Thermal Resistivity	-
Thermal Conductivity	1.1W/m-K
Storage/Refrigeration Temperature	-