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BSM250D17P2E004

Rohm Semiconductor

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BSM250D17P2E004

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Module

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Description:

HALF BRIDGE MODULE CONSISTING OF

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Mfr	Rohm Semiconductor
Series	-
Package	Box
Technology	Silicon Carbide (SiC)
FET Feature	-
Power - Max	1800W (Tc)
Configuration	2 N-Channel (Half Bridge)
Mounting Type	Chassis Mount
Package / Case	Module
Product Status	Active
Vgs(th) (Max) @ Id	4V @ 66mA
Base Product Number	BSM250
Operating Temperature	-40°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs	-
Supplier Device Package	Module
Gate Charge (Qg) (Max) @ Vgs	-
Drain to Source Voltage (Vdss)	1700V (1.7kV)
Input Capacitance (Ciss) (Max) @ Vds	30000pF @ 10V
Current - Continuous Drain (Id) @ 25°C	250A (Tc)