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BDN16-3CB/A01

CTS Thermal Management Products

Product No:

BDN16-3CB/A01

Package:

-

Batch:

-

Datasheet:

Description:

HEATSINK CPU W/ADHESIVE 1.61"SQ

Quantity:

Delivery:

Payment:

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BDN16-3CB/A01 - Product Information

Parameter Info

User Guide

Mfr CTS Thermal Management Products
Type Top Mount
Shape Square, Pin Fins
Width 1.610" (40.89mm)
Length 1.610" (40.89mm)
Series BDN
Package Tray
Diameter -
Material Aluminum
Fin Height 0.355" (9.02mm)
Shelf Life 24 Months
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Product Status Active
Material Finish Black Anodized
Attachment Method Thermal Tape, Adhesive (Included)
Base Product Number BDN16
Thermal Resistance @ Natural 13.50°C/W
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 4.50°C/W @ 400 LFM