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ACA-SPI-006-K01

LOTES

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ACA-SPI-006-K01

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SPI 16 PIN_IC 300mil

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Mfr	LOTES
Type	SOIC
Series	-
Package	Tape & Reel (TR)
Features	Board Guide, Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Mounting Type	Surface Mount
Pitch - Mating	0.050" (1.27mm)
Product Status	Active
Housing Material	Liquid Crystal Polymer (LCP)
Contact Resistance	30mOhm
Contact Finish - Post	Gold
Operating Temperature	-
Contact Finish - Mating	Gold
Contact Material - Post	Phosphor Bronze
Termination Post Length	-
Contact Material - Mating	Phosphor Bronze
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	1.00µin (0.025µm)
Contact Finish Thickness - Mating	1.00µin (0.025µm)
Number of Positions or Pins (Grid)	16 (2 x 8)