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70-3213-0810

Kester Solder

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70-3213-0810

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SOLDER PASTE NXG1 NO CLEAN 500GM

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Mfr	Kester Solder
Form	Jar, 17.64 oz (500g)
Type	Solder Paste
Series	NXG1
Package	Bulk
Process	Lead Free
Diameter	-
Flux Type	No-Clean
Mesh Type	3
Shelf Life	8 Months
Wire Gauge	-
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point	423 ~ 424°F (217 ~ 218°C)
Shipping Info	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Product Status	Active
Shelf Life Start	Date of Manufacture
Base Product Number	70-3213
Storage/Refrigeration Temperature	32°F ~ 50°F (0°C ~ 10°C)