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57-3343-8109

Kester Solder

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57-3343-8109

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Description:

SOLDER 500G JAR,SN96.5 AG3.0

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Mfr	Kester Solder
Form	Jar, 17.64 oz (500g)
Type	Solder Paste
Series	-
Weight	1.1 lbs (499 g)
Package	Jar
Process	Lead Free
Diameter	-
Flux Type	-
Mesh Type	-
Shelf Life	-
Wire Gauge	-
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point	423 ~ 424°F (217 ~ 218°C)
Shipping Info	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Product Status	Obsolete
Shelf Life Start	-
Storage/Refrigeration Temperature	-