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40-6554-11

Aries Electronics

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40-6554-11

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CONN IC DIP SOCKET ZIF 40POS GLD

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Mfr	Aries Electronics
Type	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Series	55
Package	Bulk
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Mounting Type	Through Hole
Pitch - Mating	0.100" (2.54mm)
Product Status	Active
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Contact Resistance	-
Base Product Number	40-6554
Contact Finish - Post	Gold
Current Rating (Amps)	1 A
Operating Temperature	-
Contact Finish - Mating	Gold
Contact Material - Post	Beryllium Copper
Termination Post Length	0.110" (2.78mm)
Contact Material - Mating	Beryllium Copper
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	-
Contact Finish Thickness - Mating	-
Number of Positions or Pins (Grid)	40 (2 x 20)