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40-526-10

Aries Electronics

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40-526-10

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CONN IC DIP SOCKET ZIF 40POS TIN

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Mfr	Aries Electronics
Type	DIP, ZIF (ZIP)
Series	Lo-PRO®file, 526
Package	Bulk
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Mounting Type	Through Hole
Pitch - Mating	0.100" (2.54mm)
Product Status	Active
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Resistance	-
Base Product Number	40-526
Contact Finish - Post	Tin
Current Rating (Amps)	3 A
Operating Temperature	-55°C ~ 105°C
Contact Finish - Mating	Tin
Contact Material - Post	Beryllium Copper
Termination Post Length	0.105" (2.67mm)
Contact Material - Mating	Beryllium Copper
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Number of Positions or Pins (Grid)	40 (2 x 20)