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28-6554-18

Aries Electronics

Product No:

28-6554-18

Manufacturer:

Aries Electronics

Package:

-

Batch:

-

Datasheet:

Description:

CONN IC DIP SOCKET ZIF 28POS

Quantity:

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In Stock : Please Inquiry

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28-6554-18 - Product Information

Parameter Info

User Guide

Mfr Aries Electronics
Type DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Series 55
Package Bulk
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Mounting Type Through Hole
Pitch - Mating 0.100" (2.54mm)
Product Status Active
Housing Material Polyetheretherketone (PEEK), Glass Filled
Contact Resistance -
Base Product Number 28-6554
Contact Finish - Post Nickel Boron
Current Rating (Amps) 1 A
Operating Temperature -55°C ~ 250°C
Contact Finish - Mating Nickel Boron
Contact Material - Post Beryllium Nickel
Termination Post Length 0.110" (2.78mm)
Contact Material - Mating Beryllium Nickel
Material Flammability Rating UL94 V-0
Contact Finish Thickness - Post 50.0µin (1.27µm)
Contact Finish Thickness - Mating 50.0µin (1.27µm)
Number of Positions or Pins (Grid) 28 (2 x 14)