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28-3574-18

Aries Electronics

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28-3574-18

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CONN IC DIP SOCKET ZIF 28POS GLD

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Mfr	Aries Electronics
Type	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Series	57
Package	Bulk
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Mounting Type	Through Hole
Pitch - Mating	0.100" (2.54mm)
Product Status	Active
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Contact Resistance	-
Base Product Number	28-3574
Contact Finish - Post	Gold
Current Rating (Amps)	1 A
Operating Temperature	-
Contact Finish - Mating	Gold
Contact Material - Post	Beryllium Copper
Termination Post Length	0.110" (2.78mm)
Contact Material - Mating	Beryllium Copper
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Number of Positions or Pins (Grid)	28 (2 x 14)