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24-C182-00

Aries Electronics

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24-C182-00

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CONN IC DIP SOCKET 24POS GOLD

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Mfr	Aries Electronics
Type	DIP, 0.6" (15.24mm) Row Spacing
Series	EJECT-A-DIP™
Package	Bulk
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Mounting Type	Surface Mount
Pitch - Mating	0.100" (2.54mm)
Product Status	Active
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Resistance	-
Base Product Number	24-C182
Contact Finish - Post	Tin
Current Rating (Amps)	3 A
Operating Temperature	-55°C ~ 105°C
Contact Finish - Mating	Gold
Contact Material - Post	Brass
Termination Post Length	0.040" (1.02mm)
Contact Material - Mating	Beryllium Copper
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Number of Positions or Pins (Grid)	24 (2 x 12)