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100-008-000

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100-008-000

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CONN IC DIP SOCKET 8POS GOLD

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Mfr	3M
Type	DIP, 0.3" (7.62mm) Row Spacing
Series	100
Package	Bulk
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Mounting Type	Through Hole
Pitch - Mating	0.100" (2.54mm)
Product Status	Obsolete
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Contact Resistance	-
Base Product Number	100-008
Contact Finish - Post	Gold
Current Rating (Amps)	1 A
Operating Temperature	-65°C ~ 125°C
Contact Finish - Mating	Gold
Contact Material - Post	Brass
Termination Post Length	0.126" (3.20mm)
Contact Material - Mating	Beryllium Copper
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	Flash
Contact Finish Thickness - Mating	8.00µin (0.203µm)
Number of Positions or Pins (Grid)	8 (2 x 4)