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10-823-90C

Aries Electronics

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10-823-90C

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CONN IC DIP SOCKET 10POS GOLD

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Mfr	Aries Electronics
Type	DIP, 0.3" (7.62mm) Row Spacing
Series	Vertisockets™ 800
Package	Bulk
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Mounting Type	Through Hole, Right Angle, Horizontal
Pitch - Mating	0.100" (2.54mm)
Product Status	Active
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Resistance	-
Base Product Number	10-823
Contact Finish - Post	Tin
Current Rating (Amps)	3 A
Operating Temperature	-55°C ~ 105°C
Contact Finish - Mating	Gold
Contact Material - Post	Brass
Termination Post Length	0.140" (3.56mm)
Contact Material - Mating	Beryllium Copper
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Number of Positions or Pins (Grid)	10 (2 x 5)